|Chip Bulletin #13: EMV Contactless Communication Protocol Specification Testing||Licensed|
|Published: May-16 |
Clarifies that approval testing can also be performed to the newer versions of EMV CCPS that have subsequently been published, and to provide approval testing migration dates for consumer mobile handsets.
|Chip Bulletin #15: Sunsetting of Visa VSDC Applet 2.7.1||Licensed|
|Published: Oct-09 |
Announcement of the sunsetting of Visa VSDC Applet 2.7.1. Explains Visa’s decision to encourage movement to products supporting the latest versions of the VIS (1.5) and VCPS (2.1) specifications
|Chip Bulletin #16: Specifications and Applets - Availability and Sunsetting||Licensed|
|Published: Aug-17 |
Outlines Visa's current offerings and plans for sunsetting older specifications and applets.
|Chip Bulletin #17: Chip Card Products - Revised Renewal and Approval Policy||Licensed|
|Published: Jan-15 |
Visa policy covering continued use of a product that has been removed from the Visa Approved Products List.
|Chip Bulletin #18: Visa VSDC 2.7.1 Applet – qVSDC New Card Check||Licensed|
|Published: May-10 |
The Visa VSDC 2.7.1 applet does not perform the qVSDC New Card check as specified in the Visa Contactless Payment Specification 2.0.2 Additions & Clarifications 3. Issuers or card personalizers using the Visa VSDC 2.7.1 applet for dual-interface card products should not personalize their cards to use this check.
|Chip Bulletin #21: Global Contactless Interoperability Rules Revised||Public|
|Published: Oct-12 |
This bulletin overrides Chip Advisory 18. To align client development timelines with Chip Acceleration Plan that Visa announced in August 2011, Visa Operating Regulations related to Visa payWave products and acceptance devices have been revised. This was announced via VBN in December 2011, however Chip Advisory 18 was not updated to reflect the changes, thus we have created Chip Bulletin 21.
|Chip Bulletin #23: Testing Availability for Updated Specifications||Licensed|
|Published: Oct-12 |
The VIS and VCPS specifications were updated a few months ago. This bulletin is to let the vendors know that updated test plans are now available and they can submit their new products developed to VIS v1.5.4 and VCPS v2.1.2 to the test labs.
|Chip Bulletin #24: Testing Products Developed to Visa Global Platform Specifications ||Licensed|
|Published: Nov-12 |
For vendors as a reminder to provide clarification on the change that is effective 1-1-2013 as it relates to card products that have been developed to the Visa Global Platform Specifications.
|Chip Bulletin #25: Sending Contactless Test Cards, Dual Interface Test Cards and Contactless Test Stickers to Visa for Cross-Testing||Licensed|
|Published: May-13 |
To notify vendors and test labs of a process change regarding the submission of contactless test cards, dual interface test cards and contactless test stickers for Visa cross-testing.
|Chip Bulletin #26 - Availability of VSDC 2.8.1T Payment Applet||Public|
|Published: Feb-13 |
This bulletin announces the availability of the VSDC v2.8.1T payment applet.
|Chip Bulletin #28: Managing Inventory of Expiring VSDC 2.7.1 Chip Card Products||Licensed|
|Published: Feb-15 |
|Chip Bulletin #29: Secure Element and Applet Mobile Product Approval Policy||Public|
|Published: Oct-13 |
An extract of the Mobile Specifications and Applets Sunset Plan, describes the current Visa product approval policy for Secure Elements and Applets used in Visa payWave for Mobile deployments.
|Chip Bulletin #31: Mobile Secure Elements - Revised Renewal and Lifecycle Management Policy||Public|
|Published: Mar-15 |
This bulletin announces Visa's secure element lifecycle management policy that is effective 1 June 2015. This new policy will be replacing the existing secure element renewal policy.
|Chip Bulletin #32: Sunset of MSD-only Contactless Reader Testing||Public|
|Published: May-15 |
This bulletin announces that Visa Approval Services will no longer accept MSD-only contactless readers for testing.
|Chip Bulletin #33: Host Card Emulation (HCE) Testing||Public|
|Published: Jun-15 |
This bulletin communicates the availability of testing for Host Card Emulation (HCE) enabled handsets.
|Chip Bulletin #34: Misapplication of Common AID Outside US||Licensed|
|Published: Nov-15 |
Recent reports in LAC indicate that some ATMs across Latin America have been erroneously programmed to accept U.S. Common AID, leading to transaction termination and confusion for U.S.-issued Debit cardholders.
|Chip Bulletin #35: Contactless ATMs||Public|
|Published: Nov-15 |
ATM vendors are reminded that Visa payWave enabled ATMs deployed in Visa Inc. and Visa Europe must meet the requirements outlined in the Transaction Acceptance Device Guide v3.0, Appendix G Contactless ATM Requirements, and that not all VCPS or EMV Contactless Book C-3 kernels may be able to meet the requirements outlined in that document.
|Chip Bulletin #36: Card Lifecycle Management Policy||Licensed|
|Published: Dec-15 |
Effective 1 January 2016 Visa is introducing a revised, holistic approach to card lifecycle management that takes into account the entire period from approval of the base chip until the date the final card using the product expires in the field.
|Chip Bulletin #37: New VSDC Applets||Licensed|
|Published: Dec-15 |
This bulletin announces the availability of the VSDC 2.8.1G applet. It also outlines the features of this applet and the forthcoming VSDC 2.9 applet.
|Chip Bulletin #38: New VSDC 2.9 Applet||Licensed|
|Published: Jun-16 |
This bulletin announces the availability of the VSDC 2.9 card payment applet.
|Chip Bulletin #39: Mobile Specifications and Applets - Availability and Sunsetting||Licensed|
|Published: Jul-17 |
Outlines Visa's current mobile offerings and plans for sunsetting older specifications and applets.
|Chip Bulletin #40: Battery Powered Dynamic CVV2 (dCVV2) Cards Accepted for Approval ||Subscriber Only|
|Published: Oct-16 |
Visa announces support for dynamic CVV2 cards and outlines the process for card product approval.
|Chip Bulletin #41 New CDET 2.3-Revision A Required by 1 March 2018 NEW||Subscriber Only|
|Published: Feb-18 |
Visa is extending the use of CDET 2.2 until 28 Feb 2018. Following that date version2.3-revision A will be required.
|Chip Bulletin #42: U.S. Processor Express Program Will Be Updated for Dual Interface Cards NEW||Subscriber Only|
|Published: Mar-18 |
Visa will introduce a new pricing structure and new profiles for the Issuer Processor Express Program.
|Chip Advisory #17: Visa payWave: PAN Sequence Number||Licensed|
|Published: Oct-10 |
Describes how the PAN Sequence Number (PSN) should be personalized on VCPS 2.1.x card applications to ensure inclusion of the PSN in VCPS 2.0.2 devices online and clearing messages.
|Chip Advisory #19: "Dynamic Authentication" does not mean "DDA" (US Region)||Public|
|Published: Oct-11 |
Clarifies the distinction between Dynamic Authentication and DDA for US Region.
|Chip Advisory #20: Visa Recommended Practices for EMV Chip Implementation in the U.S.||Public|
|Published: Jul-12 |
Recommended practices for issuers, acquirers, merchants, processors and vendors in the process of planning, adopting and implementing chip technology programs in the U.S.
|Chip Advisory #22: Updated Policy - Chip Devices with Expired EMV Approvals||Public|
|Published: Feb-12 |
Updated policy: Addresses testing and deployment of devices with expired EMV approvals.